AT24C64Contact Card

PVC Pre Printed Memory IC AT24C64 Chip Contact Card

PVC pre printed / blank contact smart card with AT24C64 chip

Description:

The AT24C64 Smart Card is a card without encryption process,standard ISO-7816 Smart Card based on the AT24C64 Memory IC with a large 8KByte of EEPROM storage and a Programmable Security Code, Standard Byte Addressing, with three wire serial bus. Suitable for 10,000 write and erase cycles together with data retention of ten years. Ideal for storing large amount of data, such as photo ID, access codes etc.
Contact IC smart card AT24C64 is optimized for use in many industrial and commercial applications and security systems.
We supply blank AT24C64 cards and AT24C64 pre-printed cards.
 

Product Specification:

• Dimensions: 85.6 x 54 mm or customized

• Thickness: 0.8 mm

• Material: PVC, PET, PETG, ABS etc for optional

• Surface: Lamination (Glossy, Matt, Frosted finished)

• Design: Customer provides high resolution artwork in AI, PSD,CDR, PDF format, or custom

• Printing Method: CMYK offset printing, silkscreen printing, laser printing, UV printing, thermal printing, inkjet, etc.

• Personalization: Logo printing, Numbering, QR code, Barcode, ID photo, etc.

• Available crafts: Magnetic stripe, Signature panel, Laser engraving, Embossing, Hole punched, etc.

 Chip Parameters:

• Low-voltage and Standard-voltage Operation

        – 2.7 (VCC = 2.7V to 5.5V)
        – 1.8 (VCC = 1.8V to 5.5V)

• Low-Power Devices (ISB = 6 µA @ 5.5V) Available

• Internally Organized 4096 x 8, 8192 x 8

• Two-wire Serial Interface

• Schmitt Trigger, Filtered Inputs for Noise Suppression

• Bidirectional Data Transfer Protocol

• 400 kHz (1.8V, 2.5V, 2.7V, 5V) Compatibility

• Write Protect Pin for Hardware Data Protection

• 32-byte Page Write Mode (Partial Page Writes Allowed)

• Partial Page Writes Allowed

• Self-timed Write Cycle (5 ms max)

• High-reliability

        – Endurance: 1 Million Write Cycles
        – Data Retention: 10 Years

• Automotive Devices Available

• 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2×3), 5-lead SOT23, 8-lead TSSOP and 8-ball dBGA2 Packages

• Die Sales: Wafer Form, Waffle Pack and Bumped Wafers

Applications:

Industrial, Commercial applications, Security systems
 

Package:

To make sure cards can be delivered without any damage,we provide the most solid and the safest packaging.